DELIVERABLES
WP1: Management and coordination
D1.1 Data management plan and project hand-book
WP2: Spin-wave circuit design
D2.1 Cascaded SW MAJ3 device design and optimisation
WP3: Design of mixed signal CMOS analog periphery integrated circuit
D3.1 Test structure APIC tape-out
WP4: Device and circuit fabrication
D4.1 SW device demonstrator test chip
WP5: Interposer design and fabrication, 2.5D system integration
WP6: Device, circuit, and system characterisation
D6.1 Report on SW device and circuit behaviour
WP7: Dissemination, communication, and exploitation
D7.1 Dissemination, exploitation, and communication plan
D7.2 First communication, dissemination, and innovation activity report
